邢唷> v  !"#$%&'()*+,-./0123456789:;<=>?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_`abcdefghijklmnopqrstuwxyz{|}~Root Entry F瓣5WorkbookETExtData: SummaryInformation(-(  羳\p Administrator Ba==_08X@"1癳0}f詺1咲媅SO1咲媅SO1咲媅SO1Arial1 Arial1Arial1Arial1Arial1.Times New Roman1Arial1 Arial1Arial1hArial1 Arial1Arial1媅SO1Arial1Arial1 癳0}f詺1Arial1.Times New Roman1Arial1 Arial1 媅SO1>媅SO1媅SO1,>媅SO1$癳0}f詺1 媅SO1媅SO15媅SO1?媅SO1媅SO1>媅SO1媅SO1媅SO1h>媅SO1>媅SO1媅SO15媅SO1 媅SO1媅SO1 PMingLiU1 PMingLiU1 hPMingLiU+""#,##0;""\-#,##05""#,##0;[Red]""\-#,##07""#,##0.00;""\-#,##0.00A""#,##0.00;[Red]""\-#,##0.00i*2_ ""* #,##0_ ;_ ""* \-#,##0_ ;_ ""* "-"_ ;_ @_ W))_ * #,##0_ ;_ * \-#,##0_ ;_ * "-"_ ;_ @_ y,:_ ""* #,##0.00_ ;_ ""* \-#,##0.00_ ;_ ""* "-"??_ ;_ @_ g+1_ * #,##0.00_ ;_ * \-#,##0.00_ ;_ * "-"??_ ;_ @_ /\$#,##0_);\(\$#,##0\)9\$#,##0_);[Red]\(\$#,##0\);\$#,##0.00_);\(\$#,##0.00\)E \$#,##0.00_);[Red]\(\$#,##0.00\)3"$"#,##0_);\("$"#,##0\)c/_-* #,##0.00_-;\-* #,##0.00_-;_-* "-"??_-;_-@_-S'_-* #,##0_-;\-* #,##0_-;_-* "-"_-;_-@_-u8_-"$"* #,##0.00_-;\-"$"* #,##0.00_-;_-"$"* "-"??_-;_-@_-+[$-409]d\-mmm\-yy;@e0_-"$"* #,##0_-;\-"$"* #,##0_-;_-"$"* "-"_-;_-@_--0.00_);[Red]\(0.00\)0.000_ 0.000% 0_ 0.00_  #,##0.00_                   # /   * -             & ( P 'P    !      *攆f7   )` +a6 "* $+  6     /  6   1  ,   / /   %    ( (8    (  ("@ @ (8!"@ @ (8  (@ (8!@ (8 (8@ @ (8!@ @  (@ @ (8!@ @ (8@ @  (@ @ (8!@ @ (8!!@ @  (  (@@ (8  @   ("@ @  (8!"@ @  !0@ @  )0!@ @  !0@ @  )0!@ @ (8!@ @  (0!@ @  (8!@ @  (8!@ @  !8@ @ !8@ @ !8!@ @ (8!!@ @ !8@ (8!@ (8!@ @  (!@ @ !8@ @  ( !8!@ @  q A8  Ax  Ax A A AX AX A @ @  Ax!@@ > Ax!@ >  Ax@@*  A| @* C@ @  A|@@*  Ax@* Ax@ @  Ax!@@ *  A|! @ * C!@ @  Ax!@ * Ax!@ @  Ax@@ +  A| + Ax@  Ax@+ Ax@  Ax  A|+  Ax+  Ax@@ +  A|@ + Ax@@  Ax@  Ax@  A|@  Ax@ @  Ax!@@ +  A|!@ +  Ax + Ax @  Ax  Ax@@ +  Ax @ + Ax@> Ax>  Ax@@ *  A|@ *  Ax@ *  Ax@*  Ax @*  Ax@ *  Ax@ * Ax@  Ax @ * Ax @  Ax A|  Ax Ax  Ax A"x@ @* Ax@ * Ax@ * Ax@ @* Ax@ * Ax * Ax@ * Ax@ * Ax@ * Ax * Ax@ @  Ax@ @ Ax@ @ Ax@ @ A|@ @ A8@ Ax@  Ax@  Ax@  A|@  Ax@ Ax@ @ Ax@  A|@  Ax@ @ Ax@ @ Ax@ @ A|@ @ Ax@ Ax@ A|@ A|@ A|@ @ A|@  Ax@ @ A|@  Ax@  A8@ @ A|@ @ A8@ @ A|@  Ax@ @ + A Ax@ @ * Ax@@  Ax @  Ax@* Ax!@@  Ax! @  Ax Ax @  Ax @ +  Ax + Ax@ @  Ax@@*  Ax @*  Ax@ @*  Ax@@ * Ax@  Ax@ Ax@ @* Ax@ @* Ax@ @* Ax Ax@ * &A|@ @  A|@ @   A|@ @  A|  A| A|@ @ A|@  A|  A|  Ax@  Ax @ A|@@ Ax >  Ax  Ax  Ax  Ax Ax Ax A| A @ @  A|@ @  Ax@ @  Ax@ @  Ax!@ @  Ax@ @  Ax+  Ax@  Ax@ @   Ax@   A|@   Ax +  Ax @  Ax  Ax @ + Ax@ @ > Ax@@   Ax @ *  Ax@ @  Ax@   Ax@ @ * Ax @ * Ax@@ * Ax@ * Ax@ * Ax@ @ * A|@ @  A<@ @ Ax@ @  Ax@ @  A|@ @  Ax@ @ Ax@ @  Ax@ @   Ax@@  Ax!@@  Ax! @  Ax!@ *  Ax@  Ax @  Ax @*  Ax@@   Ax@   Ax @  Ax @ * Ax@@ *  Ax@@ @  Ax @ * Ax@  Ax@@   Ax @   A|@@  Ax@  Ax + Ax@ > Ax @ * Ax@@ * Q<@ @ Q<@ @ A8@@ A8@ A8 @ Ax@ @  A<@ @ Ax@@  Ax@  Ax @  A|@ @  Q|@ @  Q|@ @  Ax@@  Ax@  Ax @  <@ @ <@ @ Ax@ @  A<@@ A<@ A< @  Ax@@ * Ax@ *  Ax@ * Ax @ * A8@   A8@ Ax  Ax Ax  Ax @  Ax @  A8 @ ||c瀠碴}A}ef }}  虣 ??v}A}蘈 }A}俏 }A}23 }x} 膊 膊膊膊}A}23 }-} }-} }-}  }-}! }A}" }A}#? }A}$23 }A}%23 }A}&23 }}' ??? ?????????蝌 ???}})  蝌 鷠}}+ ??? ?????????ゥ }A},ef }A}- }A}. 鷠}U}/ }A}0骑 a}A}1霚 渆}A}2ef }A}3 }A}4ef }A}5蘈 }A}7ef }A}8蘈 }A}9 }A}: }A};ef }A}<蘈 }A}= }A}>蘈 }A}?23 }A}@ }A}B蘈 }A}C23 }(}z}<}| }<}} }<}~ }<} }<} }(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}(}}<} }<} }(}}(}}(}}<} }(}}(}}(}}(}!}(}#}(}$}(}%}(}&}(}'}(}(}(}-}(}0}(}1}(}2}(}9}(}:}(};}<}> }(}F}(}H}(}I}(}J}(}K}(}L}(}M}(}N}(}O}(}P}(}S}(}[ 8^膲!20% - :_寚eW[湗r 32&20% - :_寚eW[湗r 3 搹eQ搹eQ!40% - :_寚eW[湗r 32'40% - :_寚eW[湗r 3頬頬!60% - :_寚eW[湗r 32(60% - :_寚eW[湗r 3  鑜蕬 鑜蕬!60% - :_寚eW[湗r 22$60% - :_寚eW[湗r 2 h槝 4h槝 4 f婮T噀,g f婮T噀,g h槝h槝!銐蕬'`噀,g 5銐蕬'`噀,g "h槝 1h槝 1 #h槝 2h槝 2!$60% - :_寚eW[湗r 12 60% - :_寚eW[湗r 1 %h槝 3h槝 3!&60% - :_寚eW[湗r 42,60% - :_寚eW[湗r 4 '搹鶴搹鶴](,N,俖12-1 ISSI for 100047 - WORLD WIDE PACKETS )梴梴3*A4 Small 210 x 297 mm 4+纇錱USCQ40% - :_寚eW[湗r 52/40% - :_寚eW[湗r 5!?60% - :_寚eW[湗r 52060% - :_寚eW[湗r 5@:_寚eW[湗r 6&1:_寚eW[湗r 6/ANormal_QRepNewFormat2!B40% - :_寚eW[湗r 62340% - :_寚eW[湗r 6!C60% - :_寚eW[湗r 62460% - :_寚eW[湗r 6/DA4 Small 210 x 297 mm7EA4 Small 210 x 297 mm 2 2 F8^膲 2_G-厤#怭}_12-1 ISSI for 100047 - WORLD WIDE PACKETScc PK 嘚釦theme/PK 嘚釦 theme/theme/PK嘚釦ky}theme/theme/themeManager.xml 蘉 @醹愘7c(Eb菜CA菭覠圩邈7芜諞K Y, 奺.埛饇,ㄚH,l崆骈x纱逫萻Q}#諓叚递 值+!,較$j=婫W栌)釫+& 8PK嘚釦4q镦theme/theme/theme1.xml鞾Oo5#зMv觢訫曒6笑嵅邰匠7烋撒&j廐H垈 q銆J欯乬{fv渦HB#=$3鱿{~鯸箕0a钀Iy闣j"i惹4嵹凛ai=@R醫OI;\遼鳚kxC$!支r穬X﹍cyY0屽瀾&\$X莲垨輨-jk R; I癥愴1牆*B&(qh\]Z┱kf狰牣眗&籐燙腾螅!y陌T0j,o^["Y[Y7縷]綻|癰x奾T2%}`j纂鹾絲Ip偽V*虵睫)hV@鰍憊分5\|咡陚汰Nвl宀Xd 赯ck帕惻7饙蜼坊驵 肉瘕祮7牁阳`陲缭K葎/|嚯>GA4攓Lx獪鈊$(^阞F!袪?啖H阿)R硨Lp!/袦習;蕝!蒔蠰祪3 1矾_荗鼲HスD/?螫/盔o瀤郲彧!M圖飞阽 鑖 鉐NF鈈+1ξ m闉囗f>\嚫苹'爦鴢7Y睒*赆|3N.绗脜75瘖厙43*n鉉.N做R#賺#茅I塀z庋>]wi(镐咁S粤詋!94_碈鹚' 岗蓖=葬抬69t憪榶鏄*滧Hq陋繀Ur0a讚 <芉oL#@邐觨B咇粆椡)=鹧紖9"幅A7艻婷hW憋Q岞蛤羨箾!鼆覵輢禽g偦4rD垶 /o钅颼&槝*递┰ M琹埴秎琨靭句9Q琌谬 K6灕{瞓q媧[∵V栲?_隋睡梭R UZ7兌6-x鈜圉寈廛7 詫慬襱盯q5s%遒,嬦Q4皉p懤f \}@U<坬|4鶓蘄Ge\ {ik P谠G[C$V粅l嘩鮬q)"s-璲鏴秡5' 糊fu-怨拐峢<:躂暤壨L^儱5∏A仌奏$痀蒙32講>*堍璟<_妺d屒$鲬謠袵u悚"V褄豟星3琕嶂襠還踶淭e8匽峤7馬羺g寳O#K蒖tZ蜁fB湹 氠1衫隦窌楨p *a摸蘢6Y>鱢玃蘉:\圶/(煸丩H祶elC肔!繰蜕士砠瀓t>)V!1)缼甼蒬BBUuveD畚炬O儀|凢l*1竉*3>LE/pcЛm鉁']鯙锑8fY岓r玈慈d 7蔪*鈦n^賺rW扭%㏑ *z?佀堈宾@椘#)韤 s˙YL镁略铬卛*负69m蝁&Li咠H艂=(K& V削.K掑凩DU臅{D 甫黯軎氫e类N茻麨g(襇N5邷JV罱6钗&3(逯a有/E4謗;晦,/鲛"zb辠5姮8學秷V="\pkA銜f!xqQc, 當慆!砡C魡:潲P[|倚 l 獥l銇t伌#h滌 &M赎晈汾j舊})m攒%.袙澢4v贉轨淺糒cvlm荖55x鰀娐肖8菢h/]| /SΔ@PK 嘚釦_rels/PK嘚釦ブх6 _rels/.rels厪蟡0 囷吔冄}Q颐%v/C/(h"脎O 劋秣=畫旂 毆免C?薶醰=偵叅%[xp啠{鄣_糚眩<10堎O糝瓸d焉襃E4b$q_槥6L吁R7`畯ㄉ趁0虨O,錏n7擫i鋌〃/鉙綈╡械根铸PK 嘚釦theme/theme/_rels/PK嘚釦 褠煰'theme/theme/_rels/themeManager.xml.rels厪M 0匃倃oo雍&輬协勪5 6?$Q祉 ,.嘺緳i粭澤c21h:闀q毩m胳嶡RN壻;d癭値o7g慘(M&$R(.1榬'J摐袏T鶂8V"＆A然蠬鱱}狇|$絙{朠除8塯/]As賲(⑵锑#洩L蔥汉倪PK嘚釦 $银[Content_Types].xml瓚薔0E鱄鼉-J湶@%閭菐洽|廊$韶钵UL襎B l,巽圭x\銧v擉T閁^h卍}悒)徽*1P'揯讞彐0)棣T闉9搇#ぼ$┐>幚矋 `?燙s]7苲b$蝬市u鶂-lV弡9>欴扸髑锣,皹5(貰去s緭z視hhs0U~,}2氳ToF0,從*=雽琽[g瘪v; 9蜾'3悓3y ; 橓o隣PK嘚釦 $银 [Content_Types].xmlPK 嘚釦_rels/PK嘚釦ブх6  _rels/.relsPK 嘚釦theme/PK 嘚釦 $theme/theme/PK 嘚釦theme/theme/_rels/PK嘚釦 褠煰'  theme/theme/_rels/themeManager.xml.relsPK嘚釦4q镦 theme/theme/theme1.xmlPK嘚釦ky} Ntheme/theme/themeManager.xmlPK ?# XTableStyleMedium9PivotStyleLight16`枬MCDqSCD"? AbbreviationsVV4饊餢( 9I& mC A@. Exemptions; #> LeadframeMaterials; @ MoistureSensitivity;(1: PlatingMaterials;0 :!Material Composition Declaration *Supplier or Manufacturing Site Information Response Date 4/15/2015 Contact Name Angela Le Contact TitleQS/DCC Engineer Contact Phone86-21-50802030Contact Email/Faxangela_le@giantec-semi.com Company NameGiantec Name of person certifying Frank zhouCertifying Title QRA DirectorCertifying PhoneCertifying EmailFrank_Zhou@giantec-semi.com Part CategoryIC Part NameEEPROMPackage FamilyMSOP Pin countPart wight (mg)Part Number(s)GT24CXXAlternative Recommended ItemNAAlternative Item NameAvailability Date Alternative Part Comments!Manufacturing Process Information0Terminal Plating/Grid Array Material CompositionTerminal Plating Thickness (um)7.5~17Terminal Base AlloyA194J-STD-020 MoistureMaximum Reflow Temp. 260 CMaximum temp. duration (sec)Maximum cycles for ReflowComment' Homogeneous Material )3rd Party Analytical Testing result (ppm)Compliance (Yes/No)- 3rd Party Analytical TestingMSDSItemNameVenderType Weight (mg)Cd PbHgCr-VIPBBsPBDEsDEHPBBPDBPDIBPRoHS JIG Level AExempt Lab. Name Report No.Date1.RoHS 2.Halogen 3.PFOS/PFOADIESMICSiliconN.D.YesNoCTIA2220522292101005 Leadframe Y踲A194+AgNDYESSGSETR22903693M01 ETR22903695M01Die attach paste%f8l鶹S502 TSNEC2201361701 TSNEC2201361703 Copper WireMKECu/PdCANEC2208861607Molding compoundSD CEL-9220HF!SHAEC22003258315 SHAEC22003258316$Lead finish (Matte Sn) on leadframeHTBJ TinTSNEC2201040501Giantec fill in&Supplier or Manufacturing Site fill in"Final Compliance Judgement of RoHS"Substance Composition Declaration JIG Substance GW(峣r(嵧懴慗/E% ir(峘S;`蛻蠎 ~vR詋LevelCategoryCASPPM-Nq\ Y踲OtherCu 7440-50-8 Fe 7439-89-6 7439-92-1P 7723-14-0Zn 7440-66-6Ag 7440-22-4Arcylate Trade secretCuring agent & hardener Silver powderPd(20)otherCEL-9220 Epoxy Resin 1 Epoxy Resin 2 Epoxy Resin 3 Phenol Resin Carbon black 1333-86-4Amorphous silica 60676-86-0Crystal silica 14808-60-7Sn 7440-31-5other Silicon 7440-21-3Si/Al Giantec fill in!Termination Material Composition: Leadframe (Underplate) Material:Value DescriptionPure matte tin=100% Sn (matte) - no Ni barrier or annealing (Heat treatment)Alloy 42Iron-based leadframe materialPure matte tin  annealedE100% Sn (matte), annealed is a heat treatment (e.g. 150C for 1 hour)CopperCu, C194, C151, C7025Pure matte tin  reflowedS100% Sn (matte), reflowed indicates plating was completely melted after applicationBeryllium CopperBe/CuPure matte tin - Ni barrierK100% Sn (matte), a nickel layer is added between the plating and base metalBrass Cu/Zn alloyPure matte tin - Ag barrierK100% Sn (matte), a silver layer is added between the plating and base metalPhosphor BronzeP-BronzePure matte tin  fused?100% Sn (matte), fusing is a reflow operation in a hot oil bathNickelNi (Used as barrier layer)-Pure matte tin - reflowed over Nickel barrier-100% Sn (matte), reflowed over a nickel layerKovarIron/Nickel based materialPure bright tin>100% Sn (bright) - no Ni barrier or annealing (Heat treatment)'Other - please give details in CommentsTo specify on Comment columnPure bright tin  annealedF100% Sn (bright), annealed is a heat treatment (e.g. 150C for 1 hour)Pure bright tin  reflowedT100% Sn (bright), reflowed indicates plating was completely melted after applicationRoHS Exemptions:Pure bright tin - Ni barrierL100% Sn (bright), a nickel layer is added between the plating and base metalPure bright tin - Ag barrierL100% Sn (bright), a silver layer is added between the plating and base metal@Mercury in compact fluorescent lamps not exceeding 5 mg per lampPure bright tin  fused@100% Sn (bright), fusing is a reflow operation in a hot oil bath2a[Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg.Pure bright tin - reflowed over Nickel barrier.100% Sn (bright), reflowed over a nickel layer2boMercury in straight fluorescent lamps for general purp<oses not exceeding triphosphate with normal lifetime 5 mgSemi-matte tinH100% Sn, material properties fall in between matte and bright conditions2cmMercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mgNickel/Palladium/GoldNi/Pd/Au:Mercury in straight fluorescent lamps for special purposesNickel/PalladiumNi/Pd>Mercury in other lamps not specifically mentioned in this listTin/Silver/CopperSn/Ag/CuOLead in glass of cathode ray tubes, electronic components and fluorescent tubesHot Dipped Tin/Silver/Copper-Sn/Ag/Cu applied in a molten tin bath process6aJLead as an alloying element in steel containing up to 0.35% lead by weight Tin/SilverSn/Ag6bNLead as an alloying element in aluminium containing up to 0.40% lead by weightHot Dipped Tin/Silver*Sn/Ag applied in a molten tin bath process6c;Lead as a copper alloy containing up to 4.0% lead by weight Tin/CopperSn/Cu7atLead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)Hot Dipped Tin/Copper*Sn/Cu applied in a molten tin bath process7c?Lead in electronic ceramic parts (e.g. piezoelectronic devices)Tin/Copper  annealed;Sn/Cu, annealed is a heat treatment (e.g. 150C for 1 hour)Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparationsTin/LeadSn/PbgHexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigeratorsTin/Lead/SilverSn/Pb/Ag9a!DecaBDE in polymeric applications Nickel/GoldNi/Au9b-Lead in lead-bronze bearing shells and bushes Tin/BismuthSn/Bi,Lead used in compliant pin connector systemsSilver/PalladiumAg/PdALead as a coating material for a thermal conduction module c-ringSilver/Palladium - Ni barrierAAg/Pd, a nickel layer is added between the plating and base metal13a Lead in optical and filter glassSilver - Ni barrierC100% Ag, a nickel layer is added between the plating and base metal13b#Cadmium in optical and filter glassGold100% AuLead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weightGold over Nickel!Au plated over a Ni-barrier layerLead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages100% NiN/ANot ApplicableImmersion SilverImm. Ag Immersion TinImm. SnElectroplated Silver100% AgMoisture Sensitivity:OSPOrganic polymer over copperHot Dipped Tin,100% Sn applied in a molten tin bath processZinc100% Zn or Zn-alloyTin/ZincSn plated over ZnAluminum100% Al Indium alloyIn bearing alloyTin/Copper HASLSn/Cu Hot Air Solder LeveledENIG!Electroless Nickel Immersion Gold5aENEPIG7Electroless Nickel/Electroless Palladium/Immersion Gold'Other - Please give details in CommentsTo specify on Comment columnANR0Affected (by moisture exposure), no JEDEC ratingNMSNot Moisture Sensitive)IPC/JEDEC J-STD-020C; go to www.jedec.org Vt  羳 %I  d褚MbP?_*+%&篭.椝邂?'篭.椝邂?(呺Q?)篭.椝邂?"3XX 兞`? 兞`?&U} {} {} {} {} s{} s {}  {}  {}  {}  {} s {} ] {} {} s{} D{} D {}  {tJuvvJJY  ,u Jw w *****;; 6 }6~~~~~~~~~~~~~~~~~~~~~~~~       )    5    6          * +   ,,,, 5  7 6888         -       ~ 9 @: #;;@ % 繠<<<`  (     !    "  . # =   $6>>>>>> % ~ @ &  ' ( /  0) 1112 */~ ? + 9,a - ~ $@ . ~ @ /&  2   0  1 34 2 ? @3 ?  4 5 6 7 8 9  :  ;  <  = > ? @ A B  C D E F G H I J K L  ~ ? M N O~ !? "P~ 2@ "P "P "P "P P P P P Q Q R S AT~ B`疱@ C DE~ @ #U $V W~ %绹@ X X X X  X  X  P  P  P P Y Q R Z F[~ G犱錊H IJ~ @ &\ '] ^~ %? X X X X  X  X  P  P  P P Y Q R Z F_~ K@皱@H IJ~ @ #` a (b~ %Q@ X X X X  X  X  P  P  P P Y Q R Z Lc~ M@渝@N OP#~ @ &d e f~ 鴸@ X X X X  X  X  P  P  P P Y Q R Z Qg~ R脲@# ###~ @ $h i j~ %@ X~ 0@ X X  X  X  P  P  P P Y Q R Z Sk~ K义@T UV {l m Wn XYZ [Q \\ bR]^]u_uuuu0uHHnH@Z@@@@@@`痍鹨(  鹌  # 饎詳5%詳5%((PP?Comment 216|^c\]4`  <IC <,鹌  # 饎詳5%詳5%((PP?Comment 218O^]4`  T<1. SOJ 2. SOP 3. TSOP-II 4. TSOP-I 5. PDIP 6. LCCC 7. QFP(LQFP/TQFP) 8. FBGA 9. PBGA<,T鹌  # 饎詳5%詳5%((PP?Comment 219 ]4`  <Q1. Pure matte Tin (100Sn) w/o Ni barrier or annealing (Heat treatment) 2. Pure matte Tin (100Sn), annealed is a heat treatment (e.g. 150 C, 1 hr) 3. Tin Bismuth (Sn2Bi)<-鹌  # 饎詳5%詳5%((PP?Comment 220F ]4`  ,<Y1. Alloy 42 2. Copper (Cu, C194, C151,C7025)<,,鹌  # 饎詳5%詳5%((PP?Comment 221]4`  <3Level 3 or 2 or 2a or 1 <,鹌  # 饎詳5%詳5%((PP?Comment 2223]4`  < 260 C <,鹌  # 饎詳5%詳5%((PP?Comment 223|wl ]4`  < 10~40S<.chhsuchhsuchhsuchhsuchhsuchhsu chhsu>@<<d      8 L{i{: 猩陏寕K Frank_Zhou@giantec-semi.com嗌陏寕K Dmailto:Wolfe_Luo@giantec-semi.comggD  羳 &%7  d褚MbP?_*+%&篭.椝邂?'篭.椝邂?(呺Q?)篭.椝邂?"1XX 兞`? 兞`?&U} s {} {}  {} ]{} {} ] {}  {} s{} {} ]{} {} {} {} D {} s {} D {}  {} D {}  {}  {}  {&tJuv,vJvJvYv;uv v ,u Jw w xyyyyyyyyzzxxxxxxxx |o,||||||||||||||||||u }*~~~~~~~~~~~~~~~~~~ Z 4/15/2015 Z Angela Le Z!QS/DCC Engineer    Z86-21-50802030  Z7angela_le@giantec-semi.com   ZGiantec Z Frank zhou Z QRA Director    Z86-21-50802030 Z9Frank_Zhou@giantec-semi.com  ZIC ZEEPROM Z MSOP    @Z ;@Z谰  ZGT24CXX  ZNA !ZNA  "  ZNA  #  ZNA  $* % @Z例 & Z7.5~17 (  Z  A194  *  ?Z例 +Z 260 C  -  $@Z 例 .  @Z 例 /  Z 谰  &   0  p  q r s   5 6 7 8 9 t u 6 v 9 w F   U x )~ 绹@ y  z { 弍Z稷@   Lffffff@) 椥^B[AD .A R +曉 h? q侵幮? D   y | } R呺Q?  裗B{ }籃 " L.A  R~  @ a>抟|? " L y ; ~ 帓W8?  _B{ %,@  R -C脞6 ? f+鰞>  y   艔1w-!?  { %礂q@  R 褚MbP? {淞yr2?  y   垸~j紅?  贙h/↓  R~  ? 鐧]2g?  y   傥鱏阏?  UUUUU饺@  R~  @ $M8?  \ ] ^~ ? y   333333? D  9庛8幊臔  R~  >@ ll羻?  y   霶呺? D  贙h/A  R 霶呺? 嚧=e?  y   )\徛(? D  VUUUU芍@  R~  O@ K~变?  ` a ~ Q@ y z {% 韡?5^哄?D ffffff? 衈B{ 徹@  R~  @X@ 伆g罊?  y  % /$仌?D ffffff? 8庛8N園  R~  @ k?y|I?  d e ~ 鴸@ y  % 呺Q呑?D ffffff-@ 8庛8帟蔃  R~  @ 5瘳h$鄫?  y   呺Q呑?  Lffffff-@ 8庛8帟蔃  R~  @ 5瘳h$鄫?  y   呺Q呑?  8庛8帟蔃  R~  @ 5瘳h$鄫?  y   襇bX9?  螥  R~  @ 哴r?  y   %u?  9庛8丂  R 褚MbP? ~瑠!譇?  y   s)@  苢 A  R +傥麟? 卵稟<l<<f8< x!x"@#@$%  y    -C脞6*? D  贙h/@ R -C脞6? 5 撙> ! !M !N !O~ !? !y! ! !!! 圉夗铒? D! 繢!! 樞^B 釦 ! R! 圉夗铒?! 橔镎f膦? ! " "N "" "y" " "!" 鹶a? D" 繢!" {匂贙S@ " R" 鹶a? D! " /b;? $ ${$% %m%d"餈  ((  鹉   # 饌詳5%詳5%((PP?Comment 13 ?]]4 `  <IC <,鹉  # 饌詳5%詳5%((PP?Comment 14 9]4`  p<1. 2X : Secure Serial EEPRM 2. 4X: DRAM (SDRAM/DDR) 3. 6X: SRAM 4. 8X: Micro Controller 5. 9X: Microwise EEPROM <,p鹉  # 饌詳5%詳5%((PP?Comment 15 * 6]4`  T<1. SOJ 2. SOP 3. TSOP-II 4. TSOP-I 5. PDIP 6. LCCC 7. QFP(LQFP/TQFP) 8. FBGA 9. PBGA<,T鹉  # 饌詳5%詳5%((PP?Comment 16R ]4`  <Q1. Pure matte Tin (100Sn) w/o Ni barrier or annealing (Heat treatment) 2. Pure matte Tin (100Sn), annealed is a heat treatment (e.g. 150 C, 1 hr) 3. Tin Bismuth (Sn2Bi)<,鹉  # 饌詳5%詳5%((PP?Comment 17 ]4`  ,<Y1. Alloy 42 2. Copper (Cu, C194, C151,C7025)<,,鹉  # 饌詳5%詳5%((PP?Comment 18 1  Q]4`  <3Level 3 or 2 or 2a or 1 <,鹉  # 饌詳5%詳5%((PP?Comment 19  ]4`  < 260 C <,鹉  # 饌詳5%詳5%((PP?Comment 20Q]4`  <10~40S <,鹉  # 饌詳5%詳5%((PP?Comment 21x]4`  <3<,鹉  # 饌詳5%詳5%((PP?Comment 30 $]4`  <Level A: 1. Cd, 2. Pb, 3. Hg, 4.. Cr=+6 5. PBBs, 6. PBDBs, 7. PCBs, 8.PCN, 9. CP, 10. TBT/TPT, 11. TBTO, 12. Asbestos,13. Azocolorants, 14. Redioactive & 15.Ozone Depleting substances Level B: 1. Antimony/its compounds, 2. Arsenic/its compounds, 3. Beryllium/its compounds, 4. Bismuth/its compounds, 5. Nickel/its compounds, 6. Selenium/its compounds, 7. Magnesium/its compounds, 8. Brominated Flame Retardants, 9. Vinyl Chloride Polymer(PVC) Other <, chhsuchhsuchhsuchhsuchhsu chhsuchhsu chhsu chhsu chhsu>@<Fd "  "  !"  !"  !"  !" ggD  羳 3%i c  d褚MbP?_*+%&?'?(?)?"1XX??&cq僓} !H} D)I} J} H} ]!I} H3     vvvXvv@ K LJ M NO M N P QR S T U VR W V U VR W V U VR W V X VR W V U VR W V X VR W V U V R Y Z U V R[J U V R \ ] U V R ^ _ U V R~ `? a U VR b c X VR b c X d b e U VR~ b@ e U VR~ b@ f U VR~ b@ g X VR b g U VR b e X VR h e U VR b e X VR i d U VR~ i @ d U VR~ i"@ d U VR i d U VR i d U VR~ i&@ d U VR~ i(@ d U V R i  d D l&BBBBBBBBB,>BBBB8BBBBBBBBBBBBBB !"'@#$%&'()*+,-./012 U  V  R i d !U !V!R~ !i,@ !d "U "V"R~ "i.@ "d #U #V#R #j #k $U $V$R %U %V%R &U &V&R &K 'U  'V!'R 'M 'N (U" (V#(R~ (l?(m )U$ )V%)R~ )i@)n *U& *V'*R *i*n +U( +V)+R~ +i@+n ,U* ,V+,R~ ,i@,n -U, -V--R~ -i@-n .U. .V/.R .i0.n /U1 /V2/R~ /i@/n 0o3 0Z40R 0p5 0V6 1qRR 1r7 1Z8 2s9*hBBBB&&4B>>>>>>>>B,>@<22猩陏寕K *IPC/JEDEC J-STD-020C; go to www.jedec.org嗌陏寕K ,http://www.jedec.org/ggD   !"#$%&'()*+,./0134567  yM5c 鄥燆鵒h珣+'迟0 X`h curtlinAdministrator@$|H詳@Q5@汙n秄Microsoft Excel 胀諟.摋+,D胀諟.摋+,l8@H \dESSI (\dlKSOProductBuildVer2052-11.8.2.8411DocumentSummaryInformation82H